ST. PAUL, Minn., Feb. 　14, 2017 　(GLOBE NEWSWIRE) -- H.B. Fuller Company (NYSE:FUL) announced today that it has introduced Active Alignment (AA) adhesives designed for camera module assembly at IPC APEX EXPO 2017 in San Diego, California.

　　At this year’s IPC APEX EXPO, H.B. Fuller is connecting with attendees and showcasing its new AA adhesives in addition to the company’s high performance, innovative adhesive solutions for electronics at Booth 733. H.B. Fuller has a global track record of recognizing trends and developing adhesive solutions to address industry challenges and changing market needs, particularly in the fast-growing and ever-changing electronics markets. Through close partnerships with electronics manufacturers around the world, the company has designed high performance adhesive solutions to respond to challenging application needs for electronic devices design and manufacturing process.

　　H.B. Fuller’s platform chemistry innovation has enabled the development of the EA6400 Series, a high-performance, AA adhesive solution for camera lens assembly. The patent-pending chemistry, “LOTERA” (Low Temperature Cure, Enhanced Reliability Adhesive), enables H.B. Fuller to target a product-specific glass transition temperature (Tg) to a given customer requirement e.g. 0 to 150°C. This capability can provide an extra performance benefit of ensuring a stable product storage modulus in the standard operating range of the devices for reliability improvement.

　　“We continually look forward to engaging technical market challenges and solving problems that offer differentiated adhesives solutions to our electronics customers,” says Matt Perry, global director, Engineering Adhesives, H.B. Fuller. “Active Alignment adhesives have further expanded our product portfolio to serve growing demand in electronics markets around the world.”

　　H.B. Fuller’s new products for camera module production, the EA6400 Series, offer customers a one-part, premixed adhesive solution with good RT work life. The products are formulated to offer high UV penetration at short UV exposure times (e.g. 2 -5 seconds), along with industry-leading, secondary thermal cure kinetics and lower temperature cure at short cure times. The formulation targets specific camera module substrates and shapes stability requirements (Rheology), while the high Tg capability enables a strong and more reliable bond.